The design of the Apple M5 chip will improve performance for servers as well as future AI tools.
According to MacRumors, Apple will use more advanced SoIC packaging technology for its M5 chip, as part of a strategy to meet the growing demand for processing power for both Mac personal computers and improve the performance of data centers and future AI tools on the cloud platform.
SoIC technology was developed by TSMC and launched in 2018, allowing chips to be stacked in a three-dimensional structure, providing better power consumption and thermal management performance than traditional two-dimensional chip designs.
According to Economic Daily, Apple has expanded its collaboration with TSMC on a next-generation hybrid SoIC package that incorporates thermoplastic carbon fiber composite molding technology. The package is said to be in the trial production stage, with the aim of mass production in 2025 and 2026, powering Apple's new Mac lineup and cloud AI servers.
The new technology is expected to be integrated into the Apple M5 chip line. In addition, Apple has been researching its own AI server processor manufactured using TSMC's 3nm process, aiming for mass production in the second half of 2025.
However, according to Haitong analyst Jeff Pu, Apple's plan is to assemble an AI server powered by its M4 chip by the end of 2025.
Currently, Apple's AI cloud servers are said to run on multiple connected M2 Ultra chips, originally designed specifically for desktop Macs.
However, with the arrival of the M5, Apple may switch to using this chip to enhance performance and optimize AI processing capabilities on its servers.
The advanced dual-use design of the M5 chip generation is said to be a sign that Apple is preparing for plans to integrate its AI supply chain, from personal computers to cloud servers and software. This promises to bring better AI experiences to users on Apple products in the future.
