Not long after the Mate XT, Huawei's next high-end Mate 70 smartphone could make the tech world pay special attention.
According to the popular Chinese leaker Digital Chat Station, there will be good news on the technology level from the SMIC-made SoCs in the upcoming Mate 70, as they will be made using a 5nm process using an older DUV machine instead of the most advanced EUV today.
That’s why US officials and the rest of the industry need to find out how Huawei and SMIC did it.
The Huawei Mate 70 comes with an exciting 5nm chip.
The Huawei Mate 70 comes with an exciting 5nm chip.
Since it is manufactured on an older DUV machine, it is likely that this SoC will be less efficient compared to 5nm chips from competitors.
However, this seems to be of little importance to Huawei, as long as the chip has the performance to run smoothly on the Mate 70, move any application without any problems and all this at low power consumption is up to the company's expectations.
It's unclear whether all models or just the Huawei Mate 70 Pro will get the new chip, but the lineup is said to have a built-in 3D recognition system.
That means it will copy the same technology used by Apple on the iPhone, Face ID, which provides extremely secure facial unlocking. I
n addition, the fingerprint reader will be integrated into the power button instead of under the screen.
Another known detail is that the back of the Huawei Mate 70 will be made of non-metallic material and the back is a synthetic leather like on the Mate XT as well as sturdy tempered glass similar to Apple.
As for the camera system, the top-end Mate 70 Pro is expected to feature a 50MP main lens, a 50MP ultra-wide lens, and a periscope telephoto lens for better performance.
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The new XMAGE image processor will be added to continue to dominate the smartphone market in terms of camera level.
Information about the Mate 70 series shared by Huawei.
Information about the Mate 70 series shared by Huawei.
Digital Chat Station also points out that the Huawei Mate 70 will have noticeable improvements in efficiency with improved performance.
This is most interesting because it not only allows for longer battery life, but also shows that the good level of efficiency allows for lower temperatures.
This makes the cooling system simpler to operate, allowing for a thinner and lighter device.
Finally, the most interesting thing is how SMIC will achieve 5nm?
The foundry and Huawei are said to have developed a 5nm chip manufacturing method by improving the 7nm DUV machine to produce 5nm wafers.
This leads to higher costs and lower yield per chip, making each chip more expensive.
It will be interesting to see if they can solve some of the performance issues.
