It is expected that the future iPhone 18 series will become more diverse thanks to the new WMCM module technology.
The A20 chip expected to power the iPhone 18 generation will introduce a significant step forward in packaging technology.
iPhone 18 Pro Max concept photo.
iPhone 18 Pro Max concept photo .
According to an account named "Mobile Phone Chip Expert" on social network Weibo, the A20 chip is not only an advanced 2nm chip but also uses a new packaging method:
Wafer-level Multi-Chip Module (WMCM).
What does WMCM do?
Currently, Apple's chips are packaged using InFo (Integrated Fan-Out), a technique that allows for compact and efficient designs.
However, InFo has limitations in terms of flexibility and scalability.
WMCM, on the other hand, offers more freedom in combining different components in a single package.
This could allow Apple to create a wider variety of chip configurations, potentially tailoring the A20 chip to specific needs and performance levels.
Benefits of WMCM:
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- Increased flexibility: WMCM allows multiple chips, such as CPUs and GPUs, to be combined in a single package.
This allows Apple to create more custom chip designs for different iPhone models.
- Improved efficiency: By packing components more tightly together, WMCM can reduce the overall size and power consumption of the chip.
Illustration photo.
Illustration photo.
- Improved performance: The close proximity of components in WMCM has the potential to improve communication and performance.
Adopting WMCM will have important implications for future iPhone models,
as the module could allow Apple to offer more differentiated features and performance levels across its entire product line without having to differentiate its chips.
For example, Apple could incorporate additional components into the iPhone Pro models while keeping the standard iPhone models still remarkably powerful.
What is chip classification?
Chip grading is a process used in the semiconductor industry to classify silicon wafers into different performance levels based on their manufacturing variations.
These variations can arise due to factors such as defects, impurities, or minor differences in the manufacturing process.
That's basically the process of chip sorting.
Chips that are fast and have no problems are sorted separately. Chips that are a little slower or have some problems are sorted separately. And chips that are slow or have a lot of problems are sorted separately.
A giant step forward
The A20 chip with WMCM capabilities represents a significant step forward in Apple’s chip packaging technology. If these rumors are accurate, they could pave the way for a more colorful iPhone lineup in the coming years.
